Dependence of energy flux on the substrate on the duration of discharge current pulses and bias potential in the process of high power impulse magnetron sputtering of copper

Abstract

This work focuses on the measurement of the energy impact on the substrate during high power impulse magnetron sputtering (HiPIMS) of copper. Reducing the duration of the current pulses from 100 to 8 μs, with amplitude of 150 A and an average discharge power of 1 kW, results in a 50% increase in the energy flow to the substrate at floating potential. At the same time, the specific energy delivered per unit volume of the deposited coating is 2–3 times higher than in the DC mode. Increasing the substrate bias potential leads to an almost linear increase in the energy flux to the substrate. The paper discusses the reasons for the increase in the energy flow to the substrate and the specific energy delivered to the coating. The possibility of controlling the energy flow to the substrate by adjusting the duration, frequency and amplitude of discharge current pulses in the HiPIMS process is demonstrated.